The laser-etching process involves the use of a Nd:YAG green (532 nm wavelength) laser to create millions of microfractures (known as cloud points) in optically pure crystal. This process is known as subsurface laser engraving (SSLE) and the process and equipment we use allows the reproduction of detailed 3D structures such as molecular and protein structures. We convert the 3D structural coordinates (often a PDB file) into a format that can be translated into precise x,y,z coordinates in order to maximize the resolution and reproduce intricate structural features.
We are able to focus the laser's energy at precise points in the 3D block allowing the fractures to occur below the surface of the crystal without any damage to the surrounding crystal.